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EXTEC Diamond Wafering Blades are available in high or low concentration in 3" (76 mm), 4" (102 mm), 5" (127 mm), 6" (152 mm), 7" (178 mm) and 8" (203 mm) diameters. High concentration is designed for routine use with most metals and ceramics. Low concentration is recommended for brittle materials such as ceramics, glass, carbides and other heat resistant materials.
EXTEC EP Wafering Blades are specifically manufactured for soft and gummy materials.
EXTEC I CBN (Cubic Boron Nitride) Wafering Blades are preferred for Iron and Cobalt Base Alloys, Nickel Base Super Alloys and Lead Base Alloys.
DW Diamond Wafering Blades or AC Advanced Ceramic Diamond Wafering Blades come complete with a Dressing Stick.
EP Diamond Wafering Blades do not require a Dressing Stick. EXTEC Universal or EXTEC Water Soluble Cutting Fluid is recommended for precision cutting and reduced cutting time.
Look for NEW! next to an item number for recently added products.
 
| CATALOG NUMBER |
DESCRIPTION |
UNIT |
| 12043 |
EXTEC AC Dressing Stick 1" x 1/2" x 3" (25.4 mm x 12.7 mm x 76 mm) |
Each |
| 12045 NEW! |
EXTEC DW Dressing Stick 1" x 1/2" x 3" (25.4 mm x 12.7 mm x 76 mm) |
Each |
| 12050 |
EXTEC Universal Cutting Fluid |
qt (0.95 l) |
| 12052 |
EXTEC Universal Cutting Fluid |
gal (3.8 l) |
| 12065 |
EXTEC Water Soluble Cutting Fluid |
qt (0.95 l) |
| 12067 |
EXTEC Water Soluble Cutting Fluid |
gal (3.8 l) |
| EXTEC Diamond Wafering Blade, High Concentration Recommended for: metal matrix composites, titanium, thermal spray coatings, printed circuit boards, bones |
| 12200 |
3" Dia. x 0.006" Thickness x 1/2" Arbor (76 mm x 0.15 mm x 12.7 mm) |
Each |
| 12205 |
4" Dia. x 0.012" Thickness x 1/2" Arbor (102 mm x 0.3 mm x 12.7 mm) |
Each |
| 12206 |
4" Dia. x 0.020" Thickness x 1/2" Arbor (102 mm x 0.5 mm x 12.7 mm) |
Each |
| 12210 |
5" Dia. x 0.015" Thickness x 1/2" Arbor (127 mm x 0.4 mm x 12.7 mm) |
Each |
| 12215 |
6" Dia. x 0.020" Thickness x 1/2" Arbor (152 mm x 0.5 mm x 12.7 mm) |
Each |
| 12220 |
7" Dia. x 0.025" Thickness x 1/2" Arbor (178 mm x 0.6 mm x 12.7 mm) |
Each |
| 12218 NEW! |
8" Dia. x 0.035" Thickness x 1/2" Arbor (203 mm x 0.9 mm x 12.7 mm) |
Each |
| EXTEC Diamond Wafering Blade, High Concentration Recommended for: aggressive cutting, ferrous and non-ferrous materials |
| 12252 NEW! |
5" Dia. x 0.020" Thickness x 1/2" Arbor (127 mm x 0.5 mm x 12.7 mm) |
Each |
| 12253 NEW! |
7" Dia. x 0.025" Thickness x 1/2" Arbor (178 mm x 0.6 mm x 12.7 mm) |
Each |
| 12254 NEW! |
8" Dia. x 0.035" Thickness x 1/2" Arbor (203 mm x 0.9 mm x 12.7 mm) |
Each |
| EXTEC EP Diamond Wafering Blade, High Concentration Recommended for: polymers, rubber, soft gummy materials |
| 12222 |
4" Dia. x .030" Thickness x 1/2" Arbor (102mm x0.83mm x 12.7mm) |
Each |
| 12224 |
5" Dia. x 0.030" Thickness x 1/2" Arbor (127 mm x 0.83 mm x 12.7 mm) |
Each |
| 12226 |
7" Dia. x 0.030" Thickness x 1/2" Arbor (178 mm x 0.83 mm x 12.7 mm) |
Each |
| 12228 NEW! |
8" Dia. x 0.035" Thickness x 1/2" Arbor (203 mm x 0.9 mm x 12.7 mm) |
Each |
Top
| CATALOG NUMBER |
DESCRIPTION |
UNIT |
| EXTEC Diamond Wafering Blade, Low Concentration Recommended for: ceramics, glass, alumina, zirconia, concrete, electronic substrates |
| 12230 |
3" Dia. x 0.006" Thickness x 1/2" Arbor (76 mm x 0.15 mm x 12.7 mm) |
Each |
| 12235 |
4" Dia. x 0.012" Thickness x 1/2" Arbor (102 mm x 0.3 mm x 12.7 mm) |
Each |
| 12240 |
5" Dia. x 0.015" Thickness x 1/2" Arbor (127 mm x 0.4 mm x 12.7 mm) |
Each |
| 12245 |
6" Dia. x 0.020" Thickness x 1/2" Arbor (152 mm x 0.5 mm x 12.7 mm) |
Each |
| 12250 |
7" Dia. x 0.025" Thickness x 1/2" Arbor (178 mm x 0.6 mm x 12.7 mm) |
Each |
| 12248 NEW! |
8" Dia. x 0.035" Thickness x 1/2" Arbor (203 mm x 0.9 mm x 12.7 mm) |
Each |
| EXTEC Diamond Wafering Blade, Low Concentration Recommended for: structural ceramics, boron nitride, silicon nitride |
| 12257 NEW! |
5" Dia. x 0.020" Thickness x 1/2" Arbor (127 mm x 0.5 mm x 12.7 mm) |
Each |
| 12258 NEW! |
7" Dia. x 0.025" Thickness x 1/2" Arbor (178 mm x 0.6 mm x 12.7 mm) |
Each |
| 12259 NEW! |
8" Dia. x 0.035" Thickness x 1/2" Arbor (203 mm x 0.9 mm x 12.7 mm) |
Each |
| EXTEC AC (Advanced Ceramic) Diamond Wafering Blade, Low Concentration Recommended for: medium ceramics, GaAs, AIN, glass fiber composites, electron packages |
| 12190 |
3" Dia. x 0.006" Thickness x 1/2" Arbor (76 mm x 0.15 mm x 12.7 mm) |
Each |
| 12192 |
4" Dia. x 0.012" Thickness x 1/2" Arbor (102 mm x 0.3 mm x 12.7 mm) |
Each |
| 12194 |
5" Dia. x 0.015" Thickness x 1/2" Arbor (127 mm x 0.5 mm x 12.7 mm) |
Each |
| 12196 |
7" Dia. x 0.020" Thickness x 1/2" Arbor (178 mm x 0.6 mm x 12.7 mm) |
Each |
| 12198 NEW! |
8" Dia. x 0.025" Thickness x 1/2" Arbor (203 mm x 0.9 mm x 12.7 mm) |
Each |
| EXTEC Diamond Wafering Blade, Low Concentration Recommended for: soft friable ceramics, composites with fine reinforcing media CaF, MgF, carbon composites |
| 12193 NEW! |
3" Dia. x 0.006" Thickness x 1/2" Arbor (76 mm x 0.15 mm x 12.7 mm) |
Each |
| 12195 NEW! |
5" Dia. x 0.015" Thickness x 1/2" Arbor (127 mm x 0.4 mm x 12.7 mm) |
Each |
| EXTEC I CBN (Cubic Boron Nitride) Wafering Blade, Low Concentration Recommended for: iron and cobalt based alloys, nickel based super alloys and lead based alloys |
| 12345 |
3" Dia. x 0.006" Thickness x 1/2" Arbor (76 mm x 0.15 mm x 12.7 mm) |
Each |
| 12350 |
4" Dia. x 0.012" Thickness x 1/2" Arbor (102 mm x 0.3 mm x 12.7 mm) |
Each |
| 12355 |
5" Dia. x 0.015" Thickness x 1/2" Arbor (127 mm x 0.4 mm x 12.7 mm) |
Each |
| 12260 |
6" Dia. x 0.020" Thickness x 1/2" Arbor (152 mm x 0.5 mm x 12.7 mm) |
Each |
| 12265 NEW! |
7" Dia. x 0.025" Thickness x 1/2" Arbor (178 mm x 0.6 mm x 12.7 mm) |
Each |
| 12268 NEW! |
8" Dia. x 0.035" Thickness x 1/2" Arbor (203 mm x 0.9 mm x 12.7 mm) |
Each |
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